Multifunction Vehicle Bus (MVB)

Multifunction Vehicle Bus Interface Module (MVB)

EKE Trainnet® MVB EMD Front EKE Trainnet® MVB EMD Side EKE Trainnet® MVB OGF Front EKE Trainnet® MVB OGF Side
TECHNICAL SPECIFICATIONS

Standards:

EN 50155
EN 45545
IEC 61375-3-1

Dimensions (W x H x D):
4 TE x 3 U x 160 mm
Weight:
ESD: 160 g / EMD: 220 g / OGF: 180 g
Input Power:
5 V DC ± 5 % (1 A max., 0.5 A typ.)
Temperature Range (operational):
-40 °C…+70 °C
MTBF (40 ºC ambient temperature):
1 320 000 h (MVB2791A)
1 950 000 h (MVB1820A)
720 000 h (MVB2616A)
Physical Medium:
Isolated Electrical Short Distance (ESD, MVB2791A) Electrical Medium Distance (EMD, MVB1820A) Optical Glass Fibre (OGF, MVB2616A)
Data Rate:
1.5 Mbit/s; Manchester encoding
VME Bus (IEC 821) Interface:
A24 Slave with D08(EO)/D16
246 kB SRAM and 512 kB traffic memory
for process and message data

module functions

Trainnet® Multifunction Vehicle Bus (MVB) modules are used to create vehicle buses or more comprehensive train communication networks. The Multifunction Vehicle Bus Module implements the MVB link layer functions of the IEC 61375-3-1 Train Communications Network standard. The TCN's real-time protocols and the routing between the MVB and other buses are implemented by the gateway CPU Module.


key features

The Trainnet® Multifunction Vehicle Bus module supports physical cable redundancy and full bus master functionality as specified in the IEC 61375-3-1 standard. Bus administrator redundancy is supported on the Software level.

TCN standard’s D-9 type connectors (or ST-bayonet fibre connectors) are located on the front panel of the module. Communication to the gateway is conducted through shared memory over the IEC 821 VME back plane bus. The MVB link layer functions are implemented by the MVB module's local processor. Multiple Trainnet® MVB modules can be controlled by a single Trainnet® CPU to implement physically separated MVB networks.

The Trainnet® MVB module has static shared RAM memory accessible from both the local CPU and the VME Bus interface. A separate memory area is reserved for message data and maintenance messages as well as for Remote Procedure Call type access to the Link Layer primitives.

The MVB module is realised through a highly efficient combination of local microprocessor, FPGA logic and a dedicated MVB controller (ASIC). In addition to strict compliance with the IEC 61375-3-1 standard, the MVB module has the capability of carrying out some diagnostic functions.


OPTIONS

Physical interface: the following MVB module physical interfaces are available: Electrical Short Distance with isolation (ESD+), Electrical Medium Distance (EMD) and Optical Glass Fibre (OGF) medium. ESD+ and EMD come with two sub D-9 connectors while OGF has four ST-bayonet fibre connectors.



Published on: 2017-03-02
EKE-Electronics Ltd
Piispanportti 7
02240 Espoo
Finland
Tel +358 9 6130 30

 

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